Modification of wood with Si compounds to limit boron leaching from treated wood and to increase termite and decay resistance

Kartal S. N. , Yoshimura T., Imamura Y.

INTERNATIONAL BIODETERIORATION & BIODEGRADATION, cilt.63, ss.187-190, 2009 (SCI İndekslerine Giren Dergi)

  • Cilt numarası: 63 Konu: 2
  • Basım Tarihi: 2009
  • Doi Numarası: 10.1016/j.ibiod.2008.08.006
  • Sayfa Sayısı: ss.187-190


In this study, we tested tetraethoxysilane and methyltriethoxysilane lane as modifying silicon-based compounds for their potential to limit boron leachability from modified wood and to increase biological durability of the wood against fungi and termites. Both the silane Compounds were used in silane state where acidified ethanol was added and stirred at ambient temperature for 30 min. We used two different processes for preservative treatments: double treatment and single treatment. In double treatment, the specimens from sugi wood were first treated with boric acid at 1% concentration and subsequently treated with the silanes. In single treatment, boric acid was mixed with the silane compounds in the silane state yielding 1% boric acid concentration. Subsequent to the treatments, wood specimens were subjected to laboratory leaching tests, and leachates were analyzed for boron content with an inductively coupled plasma (ICP) spectrometry. ICP analyses showed that silane treatments were able to limit boron leaching from treated wood by about 40% in all cases for each silane compound. Wood specimens were then subjected to laboratory termite and decay resistance tests using the subterranean termites, Captotermes formosanus, and the wood decaying fungi, Fomitopsis palustris and Trametes versicolor. Termite and fungal decay resistance tests revealed that resistance of modified wood with the silane and boron compounds increased when compared to untreated and boron-only treated wood specimens. More in-depth studies on the mechanisms of interactions between the silicon compounds, boron elements and wood components are in progress. (C) 2008 Elsevier Ltd. All rights reserved.